电子元件失效分析IC component failure analysis
电子产品为何失效 Why do electronic products fail ?
失效分析的目标 The objectives of failure analysis
失效分析流程 Failure analysis flow charts
常用失效分析工具 tools in IC component failure analysis
电子封装失效分析Electrical package failure analysis
典型封装工艺流程 Typical electrical process
电子封装典型失效模式 Typical failure mode of electrical package
电子封装失效分析方法和工具 Failure analysis flow charts
电子元件失效分析复杂度分级 IC component failure analysis complexity
典型案例 typical case study
组装焊点失效分析Solder joint failure analysis
典型组装工艺流程 Typical SMTA process
组装焊点典型失效模式 Typical failure mode of solder joint
组装焊点失效分析方法和工具 Solder joint failure analysis
典型案例 Typical case study
可靠性、质量认证及测试Reliability, Qualification and test
微电子器件及微系统简介 Brief introduction of microelectronic devices and micro-electronic systems
可靠性描述和浴盆曲线 Reliability description and bathtub curve
常见可靠性模型和加速因子估算 Common reliability model and active factor estimation
可靠性试验和认证 Typical reliability tests
器件结构分析 Package construction analysis
电子器件静电防护和过电损伤ESD and EOS
静放电/电过应力基本概念介绍 ESD/EOS definition and distinguish
器件/系统静放电评估和实验方法 Component level ESD while system level ESD evaluation and test
静放电控制和检查 Typical ESD control and checklist in manufacture process
电过应力预防和根因分析难点 Typical EOS prevention and challenge of root cause identification
典型案例 Case study
